Customization of gold impregnated circuit boards

High-frequency circuits are often highly integrated, wiring density, the choice of multi-layer circuit board is necessary for wiring, but also to reduce interference is a useful wrist. In the PCBLayout stage, a reasonable selection of a certain number of layers of Printed Circuit Board scale, can fully apply the middle layer to set the shield, to better complete the proximity of grounding, and useful to reduce parasitic inductance and shorten the transmission length of the signal, together with a substantial reduction in signal interfering, etc., all these methods are beneficial to the reliability of high-frequency circuits. However, there is also a problem, the higher the number of layers of the circuit board, the more complicated the manufacturing process, the higher the unit cost, which requires us to suspend the PCBLayout, in addition to selecting the right number of layers of circuit boards, but also the need to suspend the planning of reasonable meta-equipment planning, and the use of the correct The wiring rules to complete the planning.